The reflow conditions (time and temperature) for SMT components should be provided by the component manufacturer. However, in most cases, manufacturers specify industry-standard reflow conditions: 125°C for 24 hours [1]. Clearly, these conditions are not suitable for all situations. For example, if there are concerns about a decline in solder joint performance or the effectiveness of lead surface treatments at high temperatures, the maximum permissible temperature must be reduced (sometimes as low as 40°C is recommended). The baking time depends on the size and shape of the package; however, in most cases, these factors are disregarded. Alternatively, the baking schedule recommended by the IPC standard (IPC-TM-650) may be adopted: 125°C for 6 hours for packages less than 2 mm thick; 24 hours for thicker packages Translated with DeepL.com (free version)

According to industry statistics, it is recommended that at least 10% of batches be sampled for testing. This will help provide a comprehensive understanding of the non-conformance rate.

The purpose of electrical testing is to verify the quality of each product in order to prevent the circulation and production of counterfeit and substandard goods. This is achieved by conducting a series of tests, or as many critical tests as possible, to assess the DC, AC, functional and parametric performance of the target components. The complexity of these tests enables test engineers to easily obtain reliable data sets, thereby identifying counterfeit components in cases where other testing methods fail to detect any issues or anomalies. Translated with DeepL.com (free version)

Pin-to-pin comparison testing and curve tracing analysis are used to verify whether components selected at random or as a complete sample from a batch comply with the performance tolerances specified in the product datasheet or those of known good devices. Combined with de-packaging and X-ray inspection, this test provides an efficient method for identifying non-conforming components.

Heat-and-chemical testing is used to detect secondary coatings on electronic components. The process involves heating the component to a specific temperature and then immersing it in a chemical solution. Once the test is complete, photographs of the component are taken under a microscope to reveal the presence of any secondary coatings.

External visual inspection – The purpose of the external visual inspection is to verify the validity of markings, part numbers, batch numbers, date codes and/or ‘PB-free’ markings; marking techniques; marking quality; mould cavities; straightness, coplanarity, scratches, bridging or other defects at the end faces; and surface texture.

Counterfeit electronic components are components whose identity has been deliberately misrepresented.